مؤتمر
Lock-in Thermography judgment for short/leakage/high resistance defects in advanced Fan-Out packages
| العنوان: | Lock-in Thermography judgment for short/leakage/high resistance defects in advanced Fan-Out packages |
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| المؤلفون: | Lin, Yu-Ting, Liu, Cheng-Hsin, Lin, Yi-Sheng, Hsiao, Yu-Hsiang |
| المصدر: | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :346-349 Dec, 2023 |
| Relation: | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9798350329575 |
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| DOI: | 10.1109/EPTC59621.2023.10457660 |