التفاصيل البيبلوغرافية
| العنوان: |
Hard bond pad plastic deformation study for adhesion estimation by 3D FEM modelling of wire bonding process |
| المؤلفون: |
Guarino, L., Caglio, C., Villa, R., Carasi, B., Passagrilli, C., Cecchetto, L. |
| المصدر: |
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :687-693 Dec, 2023 |
| Relation: |
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
