مؤتمر
Effect of Underfill on Substrate Trace Crack under PTC
| العنوان: | Effect of Underfill on Substrate Trace Crack under PTC |
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| المؤلفون: | Yu, Wei, Pan, Ling, Aik Boo, Kelvin Tan, Xing Che, Fa, Ong, Yeow Chon, Wan Ng, Hong, Fan, Richard |
| المصدر: | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :678-682 Dec, 2023 |
| Relation: | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9798350329575 |
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| DOI: | 10.1109/EPTC59621.2023.10457898 |