مؤتمر
Novel Method of Hermetic Sealing of Electronics Package by Electron Beam Welding
| العنوان: | Novel Method of Hermetic Sealing of Electronics Package by Electron Beam Welding |
|---|---|
| المؤلفون: | BV, Kiran Kumar, J, Pradyumna, DN, Abhishek |
| المصدر: | 2023 16th International Conference on Sensing Technology (ICST) Sensing Technology (ICST), 2023 16th International Conference on. :1-6 Dec, 2023 |
| Relation: | 2023 16th International Conference on Sensing Technology (ICST) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9798350395341 |
|---|---|
| DOI: | 10.1109/ICST59744.2023.10460770 |