التفاصيل البيبلوغرافية
| العنوان: |
Space Mapped Neuromodeling for Fast & Accurate Signal Integrity Analysis of Rough On-chip Copper Interconnects |
| المؤلفون: |
Kushwaha, Suyash, Guglani, Surila, Soleimani, Nastaran, Pathania, Sunil, Kumar, Somesh, Trinchero, Riccardo, Roy, Sourajeet, Sharma, Rohit |
| المصدر: |
2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Advanced Packaging and Systems (EDAPS), 2023 IEEE Electrical Design of. :1-3 Dec, 2023 |
| Relation: |
2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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