دورية أكاديمية
Liquid Metal Fluidic Connection and Floating Die Structure for Ultralow Thermomechanical Stress of SiC Power Electronics Packaging
| العنوان: | Liquid Metal Fluidic Connection and Floating Die Structure for Ultralow Thermomechanical Stress of SiC Power Electronics Packaging |
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| المؤلفون: | Mu, W., Janabi, A., Hu, B., Shillaber, L., Long, T. |
| المصدر: | IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 39(7):7808-7814 Jul, 2024 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 08858993 19410107 |
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| DOI: | 10.1109/TPEL.2024.3379121 |