التفاصيل البيبلوغرافية
العنوان: |
Model Order Reduction of a Microelectronic Package Subjected to Temperature Cycling and Vibration Test |
المؤلفون: |
Yuan, Chengdong, Niessner, Martin, Bechtold, Tamara |
المصدر: |
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-4 Apr, 2024 |
Relation: |
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
قاعدة البيانات: |
IEEE Xplore Digital Library |