التفاصيل البيبلوغرافية
| العنوان: |
Sintering Mechanism Analysis of Cu Nanoparticles via Molecular Dynamics |
| المؤلفون: |
Hou, Fengze, Ge, Honglin, Sun, Zhanxing, Zhou, Yunyan, You, Xiangan, Su, Meiying, Chen, Chuan, Wang, Qidong, Cao, Liqiang |
| المصدر: |
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-6 Apr, 2024 |
| Relation: |
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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