التفاصيل البيبلوغرافية
| العنوان: |
A Link Between the Lab and the Real World - A Setup for Accelerated Aging of Power Electronics Using Mission Profiles from the Field |
| المؤلفون: |
Eng, Mattias P., Mishra, Madhav, Vermelin, Wilhelm Soderkvist, Andersson, Dag, Brinkfeldt, Klas |
| المصدر: |
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-6 Apr, 2024 |
| Relation: |
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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