التفاصيل البيبلوغرافية
العنوان: |
A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies |
المؤلفون: |
Kamble, Vikram G, Patel, Dhaval Rasheshkumar, Schipfer, Christian, Thalhamer, Andreas, Zuendel, Julia, Krivec, Thomas, Antretter, Thomas, Fuchs, Peter Filipp |
المصدر: |
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-7 Apr, 2024 |
Relation: |
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
قاعدة البيانات: |
IEEE Xplore Digital Library |