التفاصيل البيبلوغرافية
| العنوان: |
Acoustic softening characterization to improve copper wire bonding FEM simulation |
| المؤلفون: |
Guarino, L., Caglio, C., Carasi, B., Alesi, M., Villa, R., Cecchetto, L. |
| المصدر: |
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-9 Apr, 2024 |
| Relation: |
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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