التفاصيل البيبلوغرافية
العنوان: |
Predictive Modeling of Thin Film Yield Stress Using Machine Learning: A Simulation-Based Approach |
المؤلفون: |
Ozdemir, Yusuf B., Okudur, Oguzhan Orkut, Gonzalez, Mario, Merckling, Clement |
المصدر: |
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-6 Apr, 2024 |
Relation: |
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
قاعدة البيانات: |
IEEE Xplore Digital Library |