التفاصيل البيبلوغرافية
| العنوان: |
Fatigue behavior of aluminum and copper metallization for SiC during APC |
| المؤلفون: |
Losbichler, Daniel, Klingler, Markus, Orso, Steffen, Wunderle, Bernhard |
| المصدر: |
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-8 Apr, 2024 |
| Relation: |
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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