التفاصيل البيبلوغرافية
| العنوان: |
Cu/SiC heterogeneous interconnection with high-frequency ultrasound at low-temperature |
| المؤلفون: |
Yang, Hao, Gan, Guisheng, Luo, Jie, Chen, Siwen, Zhou, Jin, Ma, Yongchong, Wang, Huaishan, Xia, Daquan, Wang, Weisheng |
| المصدر: |
2023 24th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2023 24th International Conference on. :1-5 Aug, 2023 |
| Relation: |
2023 24th International Conference on Electronic Packaging Technology (ICEPT) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
Full Text Finder