دورية أكاديمية
Metrology of Silicon Wafers Through Synchrotron Section Topography and X-Ray Diffraction Imaging
| العنوان: | Metrology of Silicon Wafers Through Synchrotron Section Topography and X-Ray Diffraction Imaging |
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| المؤلفون: | Xin, X., Gorji, N.E., Tseng, M. |
| المصدر: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(7):1164-1171 Jul, 2024 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 21563950 21563985 |
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| DOI: | 10.1109/TCPMT.2024.3386069 |