مؤتمر
A Comprehensive SPICE Modeling Methodology for Hot-carrier Degradation
| العنوان: | A Comprehensive SPICE Modeling Methodology for Hot-carrier Degradation |
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| المؤلفون: | Monga, Udit, Gogineni, Usha, Hetzel, Ines, Jin, Chong, Steinmair, Alexander |
| المصدر: | 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2024 8th IEEE. :1-3 Mar, 2024 |
| Relation: | 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9798350371529 |
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| DOI: | 10.1109/EDTM58488.2024.10511396 |