التفاصيل البيبلوغرافية
| العنوان: |
Optimization of Tungsten Plug Thin Film Process to Improve the Fill Seam and Contact Resistance in 180nm CMOS Technology |
| المؤلفون: |
Chauhan, A.K., Teja, V.S., Chawla, P., Sharma, A.K., Attri, R., Gupta, M., Singh, M.K., Wadhwa, M. |
| المصدر: |
2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2024 8th IEEE. :1-3 Mar, 2024 |
| Relation: |
2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
