A Time-Matched SiO2-Layer Etch for Advanced MEMS Foundry Processesd Multi-Project Chip (MPC)

التفاصيل البيبلوغرافية
العنوان: A Time-Matched SiO2-Layer Etch for Advanced MEMS Foundry Processesd Multi-Project Chip (MPC)
المؤلفون: Kumar, Sushil, Joshi, Khanjan, Singh, Pushpapraj
المصدر: 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) Solid-State Sensors, Actuators and Microsystems (Transducers), 2023 22nd International Conference on. :437-440 Jun, 2023
Relation: 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9784886864352
تدمد:21670021