Towards Additive Manufacturing Based Packaging of Mm-Wave Antenna Arrays and Beamformer ICs

التفاصيل البيبلوغرافية
العنوان: Towards Additive Manufacturing Based Packaging of Mm-Wave Antenna Arrays and Beamformer ICs
المؤلفون: Liu, Ruoke, Mumcu, Gokhan, Wang, Jing
المصدر: 2024 IEEE Wireless and Microwave Technology Conference (WAMICON) Wireless and Microwave Technology Conference (WAMICON), 2024 IEEE. :1-3 Apr, 2024
Relation: 2024 IEEE Wireless and Microwave Technology Conference (WAMICON)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9798350344943
DOI:10.1109/WAMICON60123.2024.10522864