مؤتمر
Towards Additive Manufacturing Based Packaging of Mm-Wave Antenna Arrays and Beamformer ICs
العنوان: | Towards Additive Manufacturing Based Packaging of Mm-Wave Antenna Arrays and Beamformer ICs |
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المؤلفون: | Liu, Ruoke, Mumcu, Gokhan, Wang, Jing |
المصدر: | 2024 IEEE Wireless and Microwave Technology Conference (WAMICON) Wireless and Microwave Technology Conference (WAMICON), 2024 IEEE. :1-3 Apr, 2024 |
Relation: | 2024 IEEE Wireless and Microwave Technology Conference (WAMICON) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9798350344943 |
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DOI: | 10.1109/WAMICON60123.2024.10522864 |