Self-Heating Effect of Device-Circuit with Back-side Power Delivery Network beyond 3nm Node

التفاصيل البيبلوغرافية
العنوان: Self-Heating Effect of Device-Circuit with Back-side Power Delivery Network beyond 3nm Node
المؤلفون: Zhao, Pan, Xu, Jinghan, Zhou, Taoyu, Zhao, Songhan, Liu, Naiqi, Li, Xinpeng, He, Yandong, Liu, Xiaoyan, Du, Gang
المصدر: 2024 IEEE International Reliability Physics Symposium (IRPS) International Reliability Physics Symposium (IRPS), 2024 IEEE. :1-6 Apr, 2024
Relation: 2024 IEEE International Reliability Physics Symposium (IRPS)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9798350369762
تدمد:19381891
DOI:10.1109/IRPS48228.2024.10529350