التفاصيل البيبلوغرافية
| العنوان: |
Effect of Off-State Stress on Data-Valid Window Margin for Advanced DRAM Using HK/MG Process Technology |
| المؤلفون: |
Lee, S., Lee, N-H, Kim, G-J, Ahn, J., Kim, IH., Ha, S., Rhee, S., Bae, GH, Lee, KW, Lee, YS, Ko, SB., Pae, S. |
| المصدر: |
2024 IEEE International Reliability Physics Symposium (IRPS) International Reliability Physics Symposium (IRPS), 2024 IEEE. :P69.TX-1-P69.TX-4 Apr, 2024 |
| Relation: |
2024 IEEE International Reliability Physics Symposium (IRPS) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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