مؤتمر
Multi-Physics Simulation of Electromigration in Cu Interconnect
| العنوان: | Multi-Physics Simulation of Electromigration in Cu Interconnect |
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| المؤلفون: | Zhang, Xuefeng, Deng, Bin, Zhang, Qingshan, Zhang, Qintong, Bian, Guodong |
| المصدر: | 2024 Conference of Science and Technology for Integrated Circuits (CSTIC) Science and Technology for Integrated Circuits (CSTIC), 2024 Conference of. :1-4 Mar, 2024 |
| Relation: | 2024 Conference of Science and Technology for Integrated Circuits (CSTIC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9798350362190 |
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| DOI: | 10.1109/CSTIC61820.2024.10531896 |