مؤتمر
Flip-Chip Bonding of SiC Chips onto Alumina Substrate for High-Temperature Applications
| العنوان: | Flip-Chip Bonding of SiC Chips onto Alumina Substrate for High-Temperature Applications |
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| المؤلفون: | Li, Feng, Lamsal, Buddhi S., Shi, Jiaqi |
| المصدر: | 2024 IEEE Workshop on Microelectronics and Electron Devices (WMED) Microelectronics and Electron Devices (WMED), 2024 IEEE Workshop on. :1-4 Mar, 2024 |
| Relation: | 2024 IEEE Workshop on Microelectronics and Electron Devices (WMED) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9798350395945 |
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| تدمد: | 19473842 |
| DOI: | 10.1109/WMED61554.2024.10534140 |