مؤتمر
Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Free Solder Alloys
| العنوان: | Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Free Solder Alloys |
|---|---|
| المؤلفون: | Zhou, Jiye, Tan, Xin F., McDonald, Stuart D., Sweatman, Keith, Akaiwa, Tetsuya, Nogita, Kazuhiro |
| المصدر: | 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :81-82 Apr, 2024 |
| Relation: | 2024 International Conference on Electronics Packaging (ICEP) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9784991191176 |
|---|---|
| DOI: | 10.23919/ICEP61562.2024.10535431 |