مؤتمر
Solid-State Bonding with SAC305 Sheets for Direct Cooling
| العنوان: | Solid-State Bonding with SAC305 Sheets for Direct Cooling |
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| المؤلفون: | Jo, Eunjin, Kim, YehRi, Park, Young-Bae, Kim, Dongjin |
| المصدر: | 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :147-148 Apr, 2024 |
| Relation: | 2024 International Conference on Electronics Packaging (ICEP) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9784991191176 |
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| DOI: | 10.23919/ICEP61562.2024.10535582 |