مؤتمر
High-speed Signal Transmission Rigid Substrate fabricated by Silver-seed Copper Plating Technique
| العنوان: | High-speed Signal Transmission Rigid Substrate fabricated by Silver-seed Copper Plating Technique |
|---|---|
| المؤلفون: | Fujikawa, Wataru, Tamura, Rei, Matsumoto, Tadashi, Fukazawa, Norimasa |
| المصدر: | 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :199-200 Apr, 2024 |
| Relation: | 2024 International Conference on Electronics Packaging (ICEP) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9784991191176 |
|---|---|
| DOI: | 10.23919/ICEP61562.2024.10535595 |