مؤتمر
Lead-Free Diffusion Bonding for High Temperature Using ZnAl Eutectic Alloy
| العنوان: | Lead-Free Diffusion Bonding for High Temperature Using ZnAl Eutectic Alloy |
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| المؤلفون: | Ikeda, Toru, Kurakazu, Tomoki, Koganemaru, Masaaki, Nishimura, Tetsuro |
| المصدر: | 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :99-100 Apr, 2024 |
| Relation: | 2024 International Conference on Electronics Packaging (ICEP) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9784991191176 |
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| DOI: | 10.23919/ICEP61562.2024.10535652 |