مؤتمر
HAZ-free Direct Laser Machining on Silicone-Based Flexible Hybrid Electronics
| العنوان: | HAZ-free Direct Laser Machining on Silicone-Based Flexible Hybrid Electronics |
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| المؤلفون: | Chen, M. H., Cheng, C. I, Lin, Y. C., Kao, J. C. |
| المصدر: | 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :25-26 Apr, 2024 |
| Relation: | 2024 International Conference on Electronics Packaging (ICEP) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9784991191176 |
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| DOI: | 10.23919/ICEP61562.2024.10535668 |