التفاصيل البيبلوغرافية
| العنوان: |
Carbon/Nitrogen Dual-Doped in P-Type Silicon Hard Mask for Wafer Thinning and Dishing Less for Hybrid Bonding |
| المؤلفون: |
Chen, Yen-Shuo, Chiu, Tzu Wei, Fan, Hua-Tai, Ko, Yu-Chien, Chen, Chu Chi, Ko, Fu-Hsiang |
| المصدر: |
2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :1-2 Apr, 2024 |
| Relation: |
2024 International Conference on Electronics Packaging (ICEP) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
