دورية أكاديمية
Comparison of Top and Bottom Cooling for Short Duration of Over-Currents for SiC Devices: An Analysis of the Quantity and Location of Heat-Absorbing Materials
| العنوان: | Comparison of Top and Bottom Cooling for Short Duration of Over-Currents for SiC Devices: An Analysis of the Quantity and Location of Heat-Absorbing Materials |
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| المؤلفون: | Bhadoria, S., G S, S., Nee, H. |
| المصدر: | IEEE Open Journal of Power Electronics IEEE Open J. Power Electron. Power Electronics, IEEE Open Journal of. 5:765-778 2024 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 26441314 |
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| DOI: | 10.1109/OJPEL.2024.3407163 |