دورية أكاديمية
Comparison of Top and Bottom Cooling for Short Duration of Over-Currents for SiC Devices: An Analysis of the Quantity and Location of Heat-Absorbing Materials
العنوان: | Comparison of Top and Bottom Cooling for Short Duration of Over-Currents for SiC Devices: An Analysis of the Quantity and Location of Heat-Absorbing Materials |
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المؤلفون: | Bhadoria, S., G S, S., Nee, H. |
المصدر: | IEEE Open Journal of Power Electronics IEEE Open J. Power Electron. Power Electronics, IEEE Open Journal of. 5:765-778 2024 |
قاعدة البيانات: | IEEE Xplore Digital Library |
تدمد: | 26441314 |
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DOI: | 10.1109/OJPEL.2024.3407163 |