مؤتمر
Heating Device for Thermal Migration of Local Zones Through Silicon Plates with a Diameter of Up to 100 mm
العنوان: | Heating Device for Thermal Migration of Local Zones Through Silicon Plates with a Diameter of Up to 100 mm |
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المؤلفون: | Gavrus, I. V., Yakovenko, A. A., Yatsenko, A. N. |
المصدر: | 2024 International Conference on Industrial Engineering, Applications and Manufacturing (ICIEAM) Industrial Engineering, Applications and Manufacturing (ICIEAM), 2024 International Conference on. :611-616 May, 2024 |
Relation: | 2024 International Conference on Industrial Engineering, Applications and Manufacturing (ICIEAM) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9798350395013 9798350395006 |
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DOI: | 10.1109/ICIEAM60818.2024.10553675 |