Heating Device for Thermal Migration of Local Zones Through Silicon Plates with a Diameter of Up to 100 mm

التفاصيل البيبلوغرافية
العنوان: Heating Device for Thermal Migration of Local Zones Through Silicon Plates with a Diameter of Up to 100 mm
المؤلفون: Gavrus, I. V., Yakovenko, A. A., Yatsenko, A. N.
المصدر: 2024 International Conference on Industrial Engineering, Applications and Manufacturing (ICIEAM) Industrial Engineering, Applications and Manufacturing (ICIEAM), 2024 International Conference on. :611-616 May, 2024
Relation: 2024 International Conference on Industrial Engineering, Applications and Manufacturing (ICIEAM)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9798350395013
9798350395006
DOI:10.1109/ICIEAM60818.2024.10553675