دورية أكاديمية
Thermal Studies of 3-D Stacked InGaAs HEMTs and Mitigation Strategy of Self-Heating Effect Using Buried Metal Insertion
| العنوان: | Thermal Studies of 3-D Stacked InGaAs HEMTs and Mitigation Strategy of Self-Heating Effect Using Buried Metal Insertion |
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| المؤلفون: | Jeong, J., Kim, S.K., Suh, Y., Shim, J., Beak, W.J., Choi, S.J., Kim, J.P., Kim, B.H., Geum, D., Kim, J., Kim, S. |
| المصدر: | IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(8):4517-4523 Aug, 2024 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 00189383 15579646 |
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| DOI: | 10.1109/TED.2024.3404419 |