Photonics IC Packaging Investigation Based on 3D Printing Approach

التفاصيل البيبلوغرافية
العنوان: Photonics IC Packaging Investigation Based on 3D Printing Approach
المؤلفون: Finardi, Celio Antonio, Hernandez-Figueroa, Hugo E., Biazoli, Claudecir Ricardo, Panepucci, Roberto Ricardo, Mattar, Jose Eduardo Cyrino
المصدر: 2024 Latin American Workshop on Optical Fiber Sensors (LAWOFS) Optical Fiber Sensors (LAWOFS), 2024 Latin American Workshop on. :1-2 May, 2024
Relation: 2024 Latin American Workshop on Optical Fiber Sensors (LAWOFS)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9786589532026
DOI:10.23919/LAWOFS62242.2024.10560544