التفاصيل البيبلوغرافية
| العنوان: |
Adhesion Layer Influence on Thermomechanical Reliability of Electroplated Copper Through-Glass Via (TGV) |
| المؤلفون: |
Yang, Junbo, Pan, Ke, Yin, Pengcheng, Lai, Yangyang, Park, Seungbae, Okoro, Chukwudi, Joshi, Dhananjay, Pollard, Scott |
| المصدر: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1820-1825 May, 2024 |
| Relation: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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