التفاصيل البيبلوغرافية
العنوان: |
Performance Evaluation of UCIe-based Die-to-Die Interface on Low-Cost 2D Packaging Technology |
المؤلفون: |
Penta, Srujan, Zheng, Ting, Tremble, Eric, Chakravarti, Aatreya, Sigler, Anthony, Zhang, Zhonghao, Benes, Carl, Bakir, Muhannad S, Sauter, Wolfgang |
المصدر: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :274-278 May, 2024 |
Relation: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
قاعدة البيانات: |
IEEE Xplore Digital Library |