Performance Evaluation of UCIe-based Die-to-Die Interface on Low-Cost 2D Packaging Technology

التفاصيل البيبلوغرافية
العنوان:	Performance Evaluation of UCIe-based Die-to-Die Interface on Low-Cost 2D Packaging Technology
المؤلفون:	Penta, Srujan, Zheng, Ting, Tremble, Eric, Chakravarti, Aatreya, Sigler, Anthony, Zhang, Zhonghao, Benes, Carl, Bakir, Muhannad S, Sauter, Wolfgang
المصدر:	2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :274-278 May, 2024
Relation:	2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
قاعدة البيانات:	IEEE Xplore Digital Library