مؤتمر
Performance Evaluation of UCIe-based Die-to-Die Interface on Low-Cost 2D Packaging Technology
| العنوان: | Performance Evaluation of UCIe-based Die-to-Die Interface on Low-Cost 2D Packaging Technology |
|---|---|
| المؤلفون: | Penta, Srujan, Zheng, Ting, Tremble, Eric, Chakravarti, Aatreya, Sigler, Anthony, Zhang, Zhonghao, Benes, Carl, Bakir, Muhannad S, Sauter, Wolfgang |
| المصدر: | 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :274-278 May, 2024 |
| Relation: | 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder كن أول من يترك تعليقا!