3.5D Advanced Packaging Enabling Heterogenous Integration of HPC and AI Accelerators

التفاصيل البيبلوغرافية
العنوان:	3.5D Advanced Packaging Enabling Heterogenous Integration of HPC and AI Accelerators
المؤلفون:	Mandalapu, Chandra Sekhar, Buch, Chintan, Shah, Priyal, Topacio, Roden, Cheng, Patrick, Wang, Liwei, Swaminathan, Raja, Smith, Alan, Wuu, John, Mysore, Kaushik, Alam, Arsalan
المصدر:	2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :798-802 May, 2024
Relation:	2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
قاعدة البيانات:	IEEE Xplore Digital Library