التفاصيل البيبلوغرافية
العنوان: |
3.5D Advanced Packaging Enabling Heterogenous Integration of HPC and AI Accelerators |
المؤلفون: |
Mandalapu, Chandra Sekhar, Buch, Chintan, Shah, Priyal, Topacio, Roden, Cheng, Patrick, Wang, Liwei, Swaminathan, Raja, Smith, Alan, Wuu, John, Mysore, Kaushik, Alam, Arsalan |
المصدر: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :798-802 May, 2024 |
Relation: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
قاعدة البيانات: |
IEEE Xplore Digital Library |