التفاصيل البيبلوغرافية
| العنوان: |
Thermal Performance and Reliability of Liquid Metal Alloys as Thermal Interface Materials for Computing Electronics Devices |
| المؤلفون: |
Fan, Guangyu, Wells, Jacob, Beam, Micheal |
| المصدر: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1705-1711 May, 2024 |
| Relation: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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