التفاصيل البيبلوغرافية
| العنوان: |
Multi-tier die stacking through collective die-to-wafer hybrid bonding |
| المؤلفون: |
Kennes, Koen, Lin, Ye, Suhard, Samuel, Bex, Pieter, Cuypers, Dieter H., Guerrero, Alice, Bumueller, Dennis, Phommahaxay, Alain, Beyer, Gerald, Beyne, Eric |
| المصدر: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :637-642 May, 2024 |
| Relation: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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