مؤتمر
A Novel Copper Microporous-Assisted Bonding Method for Fine-Pitch Cu/Sn Microbump 3D Interconnects
| العنوان: | A Novel Copper Microporous-Assisted Bonding Method for Fine-Pitch Cu/Sn Microbump 3D Interconnects |
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| المؤلفون: | Wang, Keyu, Lyu, Shuhang, Wei, Tiwei |
| المصدر: | 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :563-570 May, 2024 |
| Relation: | 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9798350375985 |
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| تدمد: | 23775726 |
| DOI: | 10.1109/ECTC51529.2024.00095 |