A Study on the Surface Activation of Plasma Treatment for Hybrid Bonding Joint Interface

التفاصيل البيبلوغرافية
العنوان: A Study on the Surface Activation of Plasma Treatment for Hybrid Bonding Joint Interface
المؤلفون: Hsu, Chih-Jing, Fang, Hsu-Nan, Su, Tzu-Yu, Jiang, Zhao-Ze, Chen, Yi-Hua, Chen, Chien-Ching, Hsu, Che-Ming, Tsai, Yu-Pin, Chiang, Yuan-Feng, Kao, Jen-Chieh, Yeh, Yung-I
المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1826-1829 May, 2024
Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9798350375985
تدمد:23775726
DOI:10.1109/ECTC51529.2024.00305