التفاصيل البيبلوغرافية
العنوان: |
A Study on the Surface Activation of Plasma Treatment for Hybrid Bonding Joint Interface |
المؤلفون: |
Hsu, Chih-Jing, Fang, Hsu-Nan, Su, Tzu-Yu, Jiang, Zhao-Ze, Chen, Yi-Hua, Chen, Chien-Ching, Hsu, Che-Ming, Tsai, Yu-Pin, Chiang, Yuan-Feng, Kao, Jen-Chieh, Yeh, Yung-I |
المصدر: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1826-1829 May, 2024 |
Relation: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
قاعدة البيانات: |
IEEE Xplore Digital Library |