التفاصيل البيبلوغرافية
| العنوان: |
Development of Thick-Core Substrate Material for Cutting-Edge IC Packaging |
| المؤلفون: |
Muguruma, Tomo, Shin, Tom, Honma, Masafumi, Saito, Hirosuke, Takahashi, Genki, Yasumoto, Jun, Washio, Teppei, Ishikawa, Yuichi, Tashiro, Yutaka, Okushima, Yoshiki, Biruni, Ahammad Al, Takahashi, Ryuji |
| المصدر: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :881-886 May, 2024 |
| Relation: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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