Vertical Fan Out(VFO) package with enhanced form factor and performances for mobile applications

التفاصيل البيبلوغرافية
العنوان: Vertical Fan Out(VFO) package with enhanced form factor and performances for mobile applications
المؤلفون: Sung, Ki-Jun, Eun, Kyoungtae, Kim, Jae-Min, Jang, Se-Hyun, Lee, Seowon, Yoon, Sungwon, Kim, Jongkwan, Kim, Minsuk, Yun, Jiyeong, Ju, Jeongho, Son, Ho-Young, Lee, Kang-Wook
المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :34-39 May, 2024
Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9798350375985
تدمد:23775726
DOI:10.1109/ECTC51529.2024.00014