التفاصيل البيبلوغرافية
| العنوان: |
A study about direct laser reflow for forming stable and reliable C4 bump interfaces on semiconductor substrates for Flip Chip applications |
| المؤلفون: |
Fettke, Matthias, Fisch, Anne, Geschke, Tom, Frick, Alexander, Alyasin, Khaled, Teutsch, Thorsten |
| المصدر: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1298-1305 May, 2024 |
| Relation: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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