Glass Panel Process Integrated Low Stress Organic Dielectric RDL Structure

التفاصيل البيبلوغرافية
العنوان: Glass Panel Process Integrated Low Stress Organic Dielectric RDL Structure
المؤلفون: Hsiung, Chien-Kang, Wang, Terry, Wozny, Sarah, Bernt, Marvin L, Chen, Kuan-Nang
المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1896-1899 May, 2024
Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9798350375985
تدمد:23775726
DOI:10.1109/ECTC51529.2024.00320