Quantifying Uncertainties in the Correlation of Simulations and Measurements Using the IEEE EPS Packaging Benchmark Suite

التفاصيل البيبلوغرافية
العنوان: Quantifying Uncertainties in the Correlation of Simulations and Measurements Using the IEEE EPS Packaging Benchmark Suite
المؤلفون: Aronsson, Jonatan, Aygun, Kemal
المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1677-1682 May, 2024
Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9798350375985
تدمد:23775726
DOI:10.1109/ECTC51529.2024.00277