Process Challenges in Thin Wafers Fabrication with Double Side Hybrid Bond Pads for Chip Stacking

التفاصيل البيبلوغرافية
العنوان:	Process Challenges in Thin Wafers Fabrication with Double Side Hybrid Bond Pads for Chip Stacking
المؤلفون:	Kumar, Mishra Dileep, Nagendra Sekhar, Vasarla, Rao, B.S.S. Chandra, Choong Chong, Ser, Rao, Vempati Srinivasa
المصدر:	2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :614-619 May, 2024
Relation:	2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
قاعدة البيانات:	IEEE Xplore Digital Library