Complex board via structure induced uneven stress/strain impact on interconnect stability: SAC305, full and hybrid LTS comparison

التفاصيل البيبلوغرافية
العنوان:	Complex board via structure induced uneven stress/strain impact on interconnect stability: SAC305, full and hybrid LTS comparison
المؤلفون:	Lee, Tae-Kyu, Park, Yujin, Ramakrishna, Gnyaneshwar, Nam, Jonghyun, Yoon, Daljin, Roh, Heera
المصدر:	2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1124-1130 May, 2024
Relation:	2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
قاعدة البيانات:	IEEE Xplore Digital Library