التفاصيل البيبلوغرافية
| العنوان: |
Mitigating Solder Beading in Non-Eutectic Low-Temperature Solder: Mechanism and Solution |
| المؤلفون: |
Teng, Saw Lip, Devarajan, Mutharasu, Nadarajah, Puurnaraj A-L, Yang Soo, Chye |
| المصدر: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1131-1136 May, 2024 |
| Relation: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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